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10 April 2024 Advancing EUV patterning through pattern shaping at Intel 18A process technology node
Robert Browning, Shurong Liang, Peter Sun, Laxmy Menon, Nadjoua Moumen, Can Guven, Nathan Strutt, Mehmet Aykol, Robert Bigwood, Sarah Williams, Kevin Anglin, Amol Gupta, Steven Sherman, Kevin Fischer, Charles Wallace, Gang Shu, Bhavin Shah, Brad Taylor
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Proceedings Volume PC12958, Advanced Etch Technology and Process Integration for Nanopatterning XIII; (2024) https://doi.org/10.1117/12.3010982
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States
Abstract
Direct print extreme ultraviolet (EUV) has proven effective for pitch scaling and design rules flexibility. As feature size shrinks, stochastic noise poses challenges that demand innovative solutions. In this abstract, we present a novel approach known as pattern shaping , that not only addresses these challenges but also facilitates new opportunities for advanced patterning strategies. Integrating pattern shaping applications into the process flow reduces process complexity, eliminates the need for additional EUV patterning layers, paves the way for pushing lithographic print boundaries, and enhances the wafer yield. This accelerates the achievement of the technology readiness milestones.
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Robert Browning, Shurong Liang, Peter Sun, Laxmy Menon, Nadjoua Moumen, Can Guven, Nathan Strutt, Mehmet Aykol, Robert Bigwood, Sarah Williams, Kevin Anglin, Amol Gupta, Steven Sherman, Kevin Fischer, Charles Wallace, Gang Shu, Bhavin Shah, and Brad Taylor "Advancing EUV patterning through pattern shaping at Intel 18A process technology node", Proc. SPIE PC12958, Advanced Etch Technology and Process Integration for Nanopatterning XIII, (10 April 2024); https://doi.org/10.1117/12.3010982
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KEYWORDS
Extreme ultraviolet
Advanced patterning
Optical lithography
Printing
Design rules
Lithography
Semiconducting wafers
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