Investigation of ultrashort pulse laser drilling of dielectric materials by combining time-resolved imaging and high-speed camera

Huijie Sun; Yusuke Ito; Guoqi Ren; Junya Hattori; Hiroshi Jo; Naohiko Sugita

doi:10.1117/12.2609582

1 April 2022 Investigation of ultrashort pulse laser drilling of dielectric materials by combining time-resolved imaging and high-speed camera

Huijie Sun, Yusuke Ito, Guoqi Ren, Junya Hattori, Hiroshi Jo, Naohiko Sugita

Author Affiliations +

Proceedings Volume PC11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII; PC119880K (2022) https://doi.org/10.1117/12.2609582
Event: SPIE LASE, 2022, San Francisco, California, United States

Conference Poster

Abstract

Ultrashort pulse laser processing has been proved as an efficient method of microfabricating dielectric materials such as silicon carbide, sapphire, and glass, yet damages are formed around the processed area. In this study, we combine a pump-probe imaging system with a high-speed camera to visualize the ultrafast phenomena of each pulse irradiation and identify the mechanism of damage generation of dielectric materials. In addition, the observations are conducted with various pulse widths to clarify the dependence on the processing conditions. The results demonstrate that the damage is mainly caused by the electron excitation and stress wave propagation.

Conference Presentation

Citation Download Citation

Huijie Sun, Yusuke Ito, Guoqi Ren, Junya Hattori, Hiroshi Jo, and Naohiko Sugita "Investigation of ultrashort pulse laser drilling of dielectric materials by combining time-resolved imaging and high-speed camera", Proc. SPIE PC11988, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII, PC119880K (1 April 2022); https://doi.org/10.1117/12.2609582

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