Eelco van Setten,1 Sofia Leitao,1 Claire van Lare,1 Jan van Schoothttps://orcid.org/0000-0001-6643-7254,1 Jo Finders,1 Kaustuve Bhattacharyya,1 Joerg Zimmermann2
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
To enable cost-effective shrink of future devices, a new High-NA EUV platform is being developed. The High-NA EUV scanner employs a novel projection optics design concept with 0.55NA that enables 8nm HP resolution and a high throughput.
In this paper we will discuss the imaging performance and technology solutions to support our customers device roadmap. We will address various aspects of high-NA EUV imaging which involves balancing key metrics like contrast for LCDU, Depth-of-Focus for defect-free process window and dose-to-size for high productivity by means of source-mask and bias optimization, wafer CD retargeting, mask stack optimization and advanced scanner corrections.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Eelco van Setten, Sofia Leitao, Claire van Lare, Jan van Schoot, Jo Finders, Kaustuve Bhattacharyya, Joerg Zimmermann, "High-NA EUV imaging: the quest for resolution, depth-of-focus, and productivity," Proc. SPIE PC12292, International Conference on Extreme Ultraviolet Lithography 2022, PC1229208 (11 November 2022); https://doi.org/10.1117/12.2645000