Highly selective radical etch, continuous thermal etch and thermal atomic layer etch

Andreas Fischer; Thorsten Lill; Mark Kawaguchi

doi:10.1117/12.2658122

30 April 2023 Highly selective radical etch, continuous thermal etch and thermal atomic layer etch

Andreas Fischer, Thorsten Lill, Mark Kawaguchi

Proceedings Volume PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII; PC124990D (2023) https://doi.org/10.1117/12.2658122
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Abstract

This conference presentation was prepared for the Advanced Etch Technology and Process Integration for Nanopatterning XII conference at SPIE Advanced Lithography + Patterning 2023.

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Andreas Fischer, Thorsten Lill, and Mark Kawaguchi "Highly selective radical etch, continuous thermal etch and thermal atomic layer etch", Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC124990D (30 April 2023); https://doi.org/10.1117/12.2658122

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KEYWORDS

Etching

Silicon

Gallium arsenide

Logic devices

Manufacturing

Oxides

Semiconducting wafers

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