Packaging Techniques For Broadband Microwave Optoelectronic Components

J. Schlafer; L. Ulbricht

doi:10.1117/12.960143

17 January 1989 Packaging Techniques For Broadband Microwave Optoelectronic Components

J. Schlafer, L. Ulbricht

Proceedings Volume 0995, High Frequency Analog Communications; (1989) https://doi.org/10.1117/12.960143
Event: O-E/Fiber LASE '88, 1988, Boston, MA, United States

Abstract

Fiber-coupled diode laser and photodiode microwave packages with performance extending to 20 GHz have been developed. A microwave transmission loss of 32 dB and relative intensity noise of less than -140 dB/Hz were measured at 1.3 μm wavelength.

Citation Download Citation

J. Schlafer and L. Ulbricht "Packaging Techniques For Broadband Microwave Optoelectronic Components", Proc. SPIE 0995, High Frequency Analog Communications, (17 January 1989); https://doi.org/10.1117/12.960143

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