NXE:3400B imaging performance assessed from a customer perspective

Friso Wittebrood; Guido Schiffelers; Colette Legein

doi:10.1117/12.2503343

3 October 2018 NXE:3400B imaging performance assessed from a customer perspective

Friso Wittebrood, Guido Schiffelers, Colette Legein

Proceedings Volume 10809, International Conference on Extreme Ultraviolet Lithography 2018; 1080905 (2018) https://doi.org/10.1117/12.2503343
Event: SPIE Photomask Technology + Extreme Ultraviolet Lithography, 2018, Monterey, California, United States

Abstract

With the introduction of the NXE:3400B EUV scanner, ASML brings EUV lithography to the standards required for High Volume Manufacturing (HVM). In this presentation we will demonstrate the imaging performance of the NXE:3400B EUV scanner for customer representative use cases, based on the on-wafer imaging performance metrics CDU, local CDU and proximity matching. The use cases included in the imaging performance assessment are defined to cover single expose logic metal, logic block mask and DRAM contact hole applications.

Conference Presentation

Citation Download Citation

Friso Wittebrood, Guido Schiffelers, and Colette Legein "NXE:3400B imaging performance assessed from a customer perspective", Proc. SPIE 10809, International Conference on Extreme Ultraviolet Lithography 2018, 1080905 (3 October 2018); https://doi.org/10.1117/12.2503343

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