Advanced Bilayer Resist Process With Optimized PMGT Formulation

W. Brunsvold; C. Lyons; W. Conley; D. Crockatt; M. Skinner; A. Uptmor

doi:10.1117/12.953041

30 January 1989 Advanced Bilayer Resist Process With Optimized PMGT Formulation

W. Brunsvold, C. Lyons, W. Conley, D. Crockatt, M. Skinner, A. Uptmor

Proceedings Volume 1086, Advances in Resist Technology and Processing VI; (1989) https://doi.org/10.1117/12.953041
Event: 1989 Santa Clara Symposium on Microlithography, 1989, San Jose, CA, United States

Abstract

The advantages of using polydimethylglutarimide (PMGI) as an underlayer for a "Portable Conformable Mask" (PCM) process have been demonstrated by Shipley Company and Rohm and Haas. Here we describe an optimized PMGI formulation coupled with an advanced bilayer resist process. This paper reports on material studies involving PMGI composition, dye additives, and a casting solvent and their relationship to PCM process control. The use of different Deep UV flood expose wavelengths during the image transfer step has an effect on image profile and exposure time. Wavelengths between 240 nm and 280 nm are preferred. For submicron imaging, a dyed Novolak resist can be used to increase the masking efficiency of the imaging layer. A PCM process using a Novolak resist imaging layer and a dyed PMGI planarizing layer controls standing wave effects and reflective notching and provides thick resist patterns for etching and lift-off applications. Excellent linewidth control and process latitude can be achieved on g-line steppers.

Citation Download Citation

W. Brunsvold, C. Lyons, W. Conley, D. Crockatt, M. Skinner, and A. Uptmor "Advanced Bilayer Resist Process With Optimized PMGT Formulation", Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); https://doi.org/10.1117/12.953041

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