A lift-off of pattern structures on the heat-mode resists

Zhengwei Wang; Kui Zhang; Guodong Chen; Yang Wang; Jingsong Wei

doi:10.1117/12.2539074

8 July 2019 A lift-off of pattern structures on the heat-mode resists

Zhengwei Wang, Kui Zhang, Guodong Chen, Yang Wang, Jingsong Wei

Proceedings Volume 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019); 110640C (2019) https://doi.org/10.1117/12.2539074
Event: Pacific Rim Laser Damage 2019 and Thin Film Physics and Applications 2019, 2019, Qingdao, China

Abstract

Laser heat-mode lithography is very useful for the fabrication of micro/nanostructure-based optical elements. In laser heat-mode lithography, the pattern structures need to be transferred to the substrates by wet-etching or dry-etching method. In this work, a lift-off method for the pattern transfer in laser heat-mode lithography was proposed and studied. A desirable undercut profile was obtained by manipulating the thermal field profile of laser heat-mode exposure, and a lift-off of Cr layer with a thickness of 80 nm on a quartz glass substrate was achieved. The results indicated that laser heat-mode lithography with lift-off process is an effective method to transfer the pattern structures to Cr layer and generate a Cr-based hard mask, which is useful for the fabrication of micro/nanostructure-based optical elements.

Citation Download Citation

Zhengwei Wang, Kui Zhang, Guodong Chen, Yang Wang, and Jingsong Wei "A lift-off of pattern structures on the heat-mode resists", Proc. SPIE 11064, Tenth International Conference on Thin Film Physics and Applications (TFPA 2019), 110640C (8 July 2019); https://doi.org/10.1117/12.2539074

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