UV curing materials for wafer level optics

M. Brehm; C. Ertl; I. Pilottek; P. Heissler

doi:10.1117/12.2545767

28 February 2020 UV curing materials for wafer level optics

M. Brehm, C. Ertl, I. Pilottek, P. Heissler

Proceedings Volume 11292, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XIII; 112920I (2020) https://doi.org/10.1117/12.2545767
Event: SPIE OPTO, 2020, San Francisco, California, United States

Abstract

Wafer level imprinting using transparent UV curable materials offers high flexibility in design, scalability and low total cost of ownership. Development of materials requires a careful balancing of all relevant properties including optical function, process constraints, (thermo-) mechanical properties and stability under reliability testing. DELO developed a modular system of materials which can be modified in this wide parameter space. These materials include highly transparent materials with refractive indices starting at below 1.4 and stretching to above 1.7 and also excellent mechanical as well as reliability performance.

Citation Download Citation

M. Brehm, C. Ertl, I. Pilottek, and P. Heissler "UV curing materials for wafer level optics", Proc. SPIE 11292, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XIII, 112920I (28 February 2020); https://doi.org/10.1117/12.2545767

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