Development of bovine serum albumin-based resins for additive manufacturing via vat photopolymerization

Patrick T. Smith; Benjaporn Narupai; S. Cem Millik; Ryan T. Shafranek; Alshakim Nelson

doi:10.1117/12.2551988

23 March 2020 Development of bovine serum albumin-based resins for additive manufacturing via vat photopolymerization

Patrick T. Smith, Benjaporn Narupai, S. Cem Millik, Ryan T. Shafranek, Alshakim Nelson

Proceedings Volume 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020; 113240T (2020) https://doi.org/10.1117/12.2551988
Event: SPIE Advanced Lithography, 2020, San Jose, California, United States

Abstract

Bio-sourced and biodegradable polymers for additive manufacturing could enable the rapid fabrication of parts for a broad spectrum of applications ranging from healthcare to aerospace. Herein, we report a resin for vat photopolymerization based on the protein, bovine serum albumin, using a commercially available laser-scanning stereolithographic apparatus (SLA) printer. Methacrylated bovine serum albumin (MA-BSA) was synthesized and formulated into aqueous resins that were used to print complex 3D objects with a resolution comparable to a commercially available resin. The MA-BSA resins were characterized by rheometry to determine the viscosity and the cure rate, as both parameters can ultimately be used to predict the printability of the resin. In the first step of patterning these materials, the MA-BSA resin was 3D printed, and in the second step, the printed construct was thermally cured to denature the globular protein and increase the intermolecular noncovalent interactions. These resins are expected to be compatible with other vat photopolymerization processes, including digital light projection (DLP) and continuous liquid interface production (CLIP).

Citation Download Citation

Patrick T. Smith, Benjaporn Narupai, S. Cem Millik, Ryan T. Shafranek, and Alshakim Nelson "Development of bovine serum albumin-based resins for additive manufacturing via vat photopolymerization", Proc. SPIE 11324, Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020, 113240T (23 March 2020); https://doi.org/10.1117/12.2551988

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