Modeling and experiment of concave microlens array on silicon wafer by grinding-polishing process with diamond slurry

Xiaohua Liu; Tianfeng Zhou; Wenchen Zhou; Allen Yi; Zhiqiang Liang; Xibin Wang

doi:10.1117/12.2523887

6 January 2020 Modeling and experiment of concave microlens array on silicon wafer by grinding-polishing process with diamond slurry

Xiaohua Liu, Tianfeng Zhou, Wenchen Zhou, Allen Yi, Zhiqiang Liang, Xibin Wang

Author Affiliations +

Proceedings Volume 11383, Sixth Asia Pacific Conference on Optics Manufacture; 1138309 (2020) https://doi.org/10.1117/12.2523887
Event: Sixth Asia Pacific Conference on Optics Manufacture, 2019, Hong Kong, Hong Kong

Abstract

Silicon wafers with micro patterns were evaluated as one of the promising molds to fabricate microlens arrays for its high hardness. This study presents an efficient yet flexible manufacturing method for microlens array silicon mold by a polishing method. Unlike conventional processes for microstructures on silicon wafers such as diamond machining and photolithography, this research demonstrates a low-cost and high efficient chemical mechanical polishing (CMP) process with steel balls and diamond slurries for precision microlenses manufacturing. During the CMP process, polishing parameters for each micro cavity need to be accurately calculated and controlled to obtain microlenses with specific apertures. Therefore, a micro wear model for micro cavity CMP process was established to calculate cavity sag height with the knowledge of down force, polishing time and relative velocity between ball and silicon wafer. Several groups of microlenses polishing were then conducted under the same conditions to validate the micro wear model. Guided by the micro wear model, a 5×5 microlens array was fabricated on silicon surfaces. The shape accuracy and surface texture of the microlens arrays were evaluated by using a white light interferometer. This research demonstrates an alternative lowcost and efficient method for microstructure fabrication on silicon wafers and possible follow up optical molding processes.

Citation Download Citation

Xiaohua Liu, Tianfeng Zhou, Wenchen Zhou, Allen Yi, Zhiqiang Liang, and Xibin Wang "Modeling and experiment of concave microlens array on silicon wafer by grinding-polishing process with diamond slurry", Proc. SPIE 11383, Sixth Asia Pacific Conference on Optics Manufacture, 1138309 (6 January 2020); https://doi.org/10.1117/12.2523887

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
9 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Silicon

Semiconducting wafers

Microlens array

Diamond

Microlens

Polishing

Particles

Show All Keywords

Keywords/Phrases

Search In:

Publication Years