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As EUV lithography becomes the new standard for electronic chip manufacturing, identifying suitable materials for higher resolution patterning stands out as a prominent challenge to reach future technology nodes. Innovative approaches to patterning are becoming more and more relevant as conventionally used photoresists approach their limitations. In this work we use the Interference Lithography tool at the Paul Scherrer Institute (Swiss Light Source) for screening of EUV Lithography materials. We highlight the EUV lithography exposure mechanism of secondary electron chemistry and its versatility in inducing a solubility switch in photosensitive materials by using a chicken egg-white albumin protein cluster as a resist to obtain sub-100 nm patterns.
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T. Allenet, T. Mortelmans, M. Vockenhuber , C-K. Yeh, Y. Ekinci, "From omelet lithography to state-of-the-art performance resists: resist screening with EUV interference lithography," Proc. SPIE 11854, International Conference on Extreme Ultraviolet Lithography 2021, 1185417 (21 December 2021); https://doi.org/10.1117/12.2600920