Research on ultra-precision grinding technology of thin-walled side of infrared materials

Yapeng Jia; Peng Wang; Hao Zhang; Hongshun Zhang; Tianyu Zhao; Bin Xuan

doi:10.1117/12.2603911

13 December 2021 Research on ultra-precision grinding technology of thin-walled side of infrared materials

Yapeng Jia, Peng Wang, Hao Zhang, Hongshun Zhang, Tianyu Zhao, Bin Xuan

Proceedings Volume 12073, 10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced and Extreme Micro-Nano Manufacturing Technologies; 120730K (2021) https://doi.org/10.1117/12.2603911
Event: Tenth International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2021), 2021, Chengdu, China

Abstract

In some optical systems, high requirements are put forward for the roughness of the thin-walled side of infrared materials, and ultra-precision grinding is needed. In this paper, the removal of residual tool marks in the side forming process of such parts is studied, and the influence of two different grinding methods of fixed abrasive on the side roughness is analyzed, and polycrystalline magnesium fluoride (MgF₂) is taken as the research object. Firstly, the comparative experiment of peripheral grinding on the side of MgF₂ is carried out by using diamond grinding wheel with different particle sizes, and then the end grinding is carried out by using different particle sizes of pellets. It is proved that the tool marks can be removed by end face grinding, and the surface roughness Ra decreases from 1.4241μm to 0.0458μm.

Citation Download Citation

Yapeng Jia, Peng Wang, Hao Zhang, Hongshun Zhang, Tianyu Zhao, and Bin Xuan "Research on ultra-precision grinding technology of thin-walled side of infrared materials", Proc. SPIE 12073, 10th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced and Extreme Micro-Nano Manufacturing Technologies, 120730K (13 December 2021); https://doi.org/10.1117/12.2603911

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