Presentation + Paper
27 May 2022 Combining thermography and stress analysis for tensile testing in a single sensor
Fabian Göttfert, Holger Sparr, Matthias Ziegenhorn, Gunnar Dammass, Matthias Krauß
Author Affiliations +
Abstract
We combine image correlation and thermography to measure the two-dimensional strain field along with the temperature distribution of a specimen in a tensile testing machine. Both methods have been combined before, yet they usually rely on different imaging devices, requiring the strain and temperature data to be aligned and parallax-corrected in post-processing. In our novel approach, we perform the image correlation directly on the thermography data – thus reducing the complexity of the measurement setup significantly. We demonstrate the method by quantifying the stress-strain-temperature relation of localized deformation bands in aluminum.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fabian Göttfert, Holger Sparr, Matthias Ziegenhorn, Gunnar Dammass, and Matthias Krauß "Combining thermography and stress analysis for tensile testing in a single sensor", Proc. SPIE 12109, Thermosense: Thermal Infrared Applications XLIV, 121090A (27 May 2022); https://doi.org/10.1117/12.2618947
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Thermography

Temperature metrology

Cameras

Digital image correlation

Infrared cameras

Infrared radiation

Speckle pattern

Back to Top