Absolute alignment measurement of underlayer and overlayer of diffraction-based overlay mark by image-based alignment metrology system

Jaeil Lee; Iksun Park; Youngjin Park; Jonghyun Hwang; Hyeonjun Ha; Jaewoong Sohn; Jaehee Lee; Jinseok Moon; Yuki Kondo; Satoshi Ando

doi:10.1117/12.2657656

27 April 2023 Absolute alignment measurement of underlayer and overlayer of diffraction-based overlay mark by image-based alignment metrology system

Jaeil Lee, Iksun Park, Youngjin Park, Jonghyun Hwang, Hyeonjun Ha, Jaewoong Sohn, Jaehee Lee, Jinseok Moon, Yuki Kondo, Satoshi Ando

Author Affiliations +

Proceedings Volume 12496, Metrology, Inspection, and Process Control XXXVII; 124962F (2023) https://doi.org/10.1117/12.2657656
Event: SPIE Advanced Lithography + Patterning, 2023, San Jose, California, United States

Conference Poster

Abstract

An absolute alignment measurement of an underlayer and overlayer of overlay mark enables an innovative overlay control by which each layer’s grid errors can be independently corrected, versus of a conventional relative overlay measurement and control. We demonstrate an absolute alignment measurement of stacked overlay marks such as Diffraction-Based Overlay (DBO) by adopting a unique method incorporated in a standalone, image-based alignment metrology system. An alignment accuracy of each layer is evaluated using product wafers by comparing alignment measurement result to the reference data. In conclusion, we were able to achieve R²>0.97 coefficient.

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Jaeil Lee, Iksun Park, Youngjin Park, Jonghyun Hwang, Hyeonjun Ha, Jaewoong Sohn, Jaehee Lee, Jinseok Moon, Yuki Kondo, and Satoshi Ando "Absolute alignment measurement of underlayer and overlayer of diffraction-based overlay mark by image-based alignment metrology system", Proc. SPIE 12496, Metrology, Inspection, and Process Control XXXVII, 124962F (27 April 2023); https://doi.org/10.1117/12.2657656

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