TiOx-based uncooled 8um FPA development at i3system

Myung Ho Kwon; Seung Ki Jeon; Sang Gu Kang; Ho Joon Lee; Myung Soo Han

doi:10.1117/12.2663239

13 June 2023 TiO_x-based uncooled 8μm FPA development at i3system

Myung Ho Kwon, Seung Ki Jeon, Sang Gu Kang, Ho Joon Lee, Myung Soo Han

Proceedings Volume 12534, Infrared Technology and Applications XLIX; 125341C (2023) https://doi.org/10.1117/12.2663239
Event: SPIE Defense + Commercial Sensing, 2023, Orlando, Florida, United States

Abstract

Uncooled infrared sensor markets have grown dramatically over the past decade in various fields, including military and commercial applications. The industry has been driven by the need for high resolution in military settings and low cost in commercial markets. Pixel pitch reduction allows manufacturing of larger format and low cost production without system integration loss. Overcoming a sensitivity degradation caused by pixel size reduction is the key driver for the next generation of uncooled sensors. This paper presents a brief overview of the status of TiOx-based SXGA(1280x1024) 8μm pitch uncooled infrared sensor status with 0.18μm 3D MEMS technology and 4 channel simultaneous integration circuit to improve performance.

Conference Presentation

Citation Download Citation

Myung Ho Kwon, Seung Ki Jeon, Sang Gu Kang, Ho Joon Lee, and Myung Soo Han "TiO_x-based uncooled 8μm FPA development at i3system", Proc. SPIE 12534, Infrared Technology and Applications XLIX, 125341C (13 June 2023); https://doi.org/10.1117/12.2663239

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