Paper
23 January 2023 Research on coupling process and technology of lensed fiber and optical chip
Dandan Guo, Guoliang Yang, Haiqing Yuan, Jinhua Bai, Ming Li, Ninghua Zhu, Xin Wang
Author Affiliations +
Proceedings Volume 12556, AOPC 2022: Optoelectronics and Nanophotonics; 125560C (2023) https://doi.org/10.1117/12.2643677
Event: Applied Optics and Photonics China 2022 (AOPC2022), 2022, Beijing, China
Abstract
As a key link in the practical application of optical modules, the packaging technology of optoelectronic devices plays a crucial role in the performance of products. Among them, the optical coupling technology is an important link in the packaging design process, and the lensed fiber coupling method still occupies a large proportion in the packaging technology due to its simple structure and low cost. In this paper, by adjusting the parameters of the taper angle and curvature radius of the lensed fiber, a simulation model of the optical coupling between the lensed fiber and commercial lasers is established, and the optical coupling efficiency and optical tolerance of the lensed fiber under different horizontal coupling distances and angular offsets are analyzed in detail. In addition, the coupling performance of the lensed fiber with two different manufacturing processes, the ground- cone lensed fiber (GCLF) and the fused-cone lensed fiber (FCLF), was compared and analyzed. According to the comparative analysis results, under the optimal parameters, the maximum coupling efficiency of GCLF reaches 89.35%, and the maximum coupling efficiency of FCLF reaches 85.59%. By adjusting the alignment angle of the laser light source in the horizontal and vertical directions, the 3db alignment tolerances of GCLF in two directions are 2.17μm and 2.05μm, respectively, and the 3db alignment tolerances of FCLF in two directions are 2.08μm and 1.96μm, respectively. From this, it can be seen that GCLF has higher coupling performance than FCLF, and a higher alignment tolerance during the package alignment process.
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dandan Guo, Guoliang Yang, Haiqing Yuan, Jinhua Bai, Ming Li, Ninghua Zhu, and Xin Wang "Research on coupling process and technology of lensed fiber and optical chip", Proc. SPIE 12556, AOPC 2022: Optoelectronics and Nanophotonics, 125560C (23 January 2023); https://doi.org/10.1117/12.2643677
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KEYWORDS
Tolerancing

Light sources

Fiber couplers

Packaging

Optical alignment

Fiber coupled lasers

Semiconductor lasers

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