Variable parameters for bonding heat seal connectors to flat panel displays

James R. Bouldin; Roger R. Reinke

doi:10.1117/12.19936

1 April 1990 Variable parameters for bonding heat seal connectors to flat panel displays

James R. Bouldin, Roger R. Reinke

Proceedings Volume 1257, Liquid Crystal Displays and Applications; (1990) https://doi.org/10.1117/12.19936
Event: Electronic Imaging: Advanced Devices and Systems, 1990, Santa Clara, CA, United States

Abstract

This paper reports on a study of the three basic parameters involved in bonding heat seal connectors to flat panel displays. Those parameters are: temperature. at the bond, pressure at the bond, and the time that the temperature and pressure are applied to the bond.

Citation Download Citation

James R. Bouldin and Roger R. Reinke "Variable parameters for bonding heat seal connectors to flat panel displays", Proc. SPIE 1257, Liquid Crystal Displays and Applications, (1 April 1990); https://doi.org/10.1117/12.19936

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