Presentation + Paper
9 April 2024 Novel spin-on overcoat materials for EUV photoresist enhancement
Author Affiliations +
Abstract
Extreme Ultraviolet (EUV) lithography has emerged as the state-of-the-art technology for high-resolution patterning in semiconductor manufacturing. However, several challenges persist in the performance of current EUV photoresists, particularly in improving resolution, sensitivity, and line-edge roughness (LER), and local critical dimension uniformity (LCDU). In this study, we describe a novel chemical trimming overcoat process as a highly versatile post-lithography spin-on overcoat to enhance photoresist performance in EUVL, enabling significant dose reduction and z-factor improvement.
Conference Presentation
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Xisen Hou, Yinjie Cen, Paul Baranowsky, and Karen Petrillo "Novel spin-on overcoat materials for EUV photoresist enhancement", Proc. SPIE 12957, Advances in Patterning Materials and Processes XLI, 1295714 (9 April 2024); https://doi.org/10.1117/12.3010862
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KEYWORDS
Photoresist materials

Extreme ultraviolet lithography

Lithography

Photoresist developing

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