Dynamics of thermal destruction of Al-(Ti,SiO2)-Si structures under pulsed action

Marina V. Koryachko; Dmitry O. Varlamov; Arkady A. Skvortsov; Evgeny B. Voloshinov; Andrey A. Guskov

doi:10.1117/12.3024948

20 February 2024 Dynamics of thermal destruction of Al-(Ti,SiO₂)-Si structures under pulsed action

Marina V. Koryachko, Dmitry O. Varlamov, Arkady A. Skvortsov, Evgeny B. Voloshinov, Andrey A. Guskov

Proceedings Volume 13065, Third International Conference on Optics, Computer Applications, and Materials Science (CMSD-III 2023); 130651E (2024) https://doi.org/10.1117/12.3024948
Event: Third International Conference on Optics, Computer Applications, and Materials Science (CMSD-III 2023), 2023, Dushanbe, Tajikistan

Abstract

The work carried out an experimental study of the features of thermal destruction of Al-Ti-Si, Al-SiO₂-Si and Al-Si systems under pulsed current exposure. The dynamics of heating systems at current densities j>3•10¹⁰ A/m² and durations up to 500 μs are presented. The initial stages of melting processes in thin-film systems and the mechanisms of destruction of structures during the passage of a single rectangular current pulse have been identified. Thus, the presence of a Ti sublayer increases the thermal stability of a multilayer system; the main mechanisms of destruction of structures are associated with the phenomenon of electrical transfer, as well as the migration of molten zones in the temperature gradient field after turning off the pulse near a local heat source. The presence of a dielectric sublayer of SiO₂ leads to increased thermal loads on the metallization system (at j=3.10¹⁰ A/m² and pulse duration up to 450 μs) compared to the Al-Si structure.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Marina V. Koryachko, Dmitry O. Varlamov, Arkady A. Skvortsov, Evgeny B. Voloshinov, and Andrey A. Guskov "Dynamics of thermal destruction of Al-(Ti,SiO₂)-Si structures under pulsed action", Proc. SPIE 13065, Third International Conference on Optics, Computer Applications, and Materials Science (CMSD-III 2023), 130651E (20 February 2024); https://doi.org/10.1117/12.3024948

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