In-situ film thickness measurements using acoustic techniques

Sanjay Bhardwaj; Butrus T. Khuri-Yakub

doi:10.1117/12.48949

1 March 1991 In-situ film thickness measurements using acoustic techniques

Sanjay Bhardwaj, Butrus T. Khuri-Yakub

Proceedings Volume 1392, Advanced Techniques for Integrated Circuit Processing; (1991) https://doi.org/10.1117/12.48949
Event: Processing Integration, 1990, Santa Clara, CA, United States

Abstract

Process monitoring and control of semiconductor fabrication parameters like film thickness are important issues limited at the present time by a lack of adequate sensors. In this paper we outline the limitations of current film thickness technology and propose two new methods for nondestructive insitu film thickness process monitoring: acoustic time domain reflectometry (TDR) and acoustic reflection coefficient phase measurements. Theoretical calculations and experimental measurements of different metal films are used to demonstrate the viability of these novel techniques.

Citation Download Citation

Sanjay Bhardwaj and Butrus T. Khuri-Yakub "In-situ film thickness measurements using acoustic techniques", Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); https://doi.org/10.1117/12.48949

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