Review of temperature measurements in the semiconductor industry

Richard L. Anderson

doi:10.1117/12.48937

1 March 1991 Review of temperature measurements in the semiconductor industry

Richard L. Anderson

Proceedings Volume 1392, Advanced Techniques for Integrated Circuit Processing; (1991) https://doi.org/10.1117/12.48937
Event: Processing Integration, 1990, Santa Clara, CA, United States

Abstract

Thermally activated processes normally depend exponentially on temperature so that accurate temperature measurements are essential for good process control. Many wafer temperature measurements are inadequate for reliable control of the manufacturing processes. With radiation thermometry for example the emittance changes during film growth can cause measurement errors of 100 to 200 C. Yet many processes are obviously running very well. How can we resolve this apparent conflict? Many temperature measurement methods thermocouples radiation thermometers etc. can be quite precise or reproducible but still grossly inaccurate. To take advantage of the repeatability and get around the inaccuracy of these sensors processes are " tuned" by running test wafers until suitable conditions are found. Each new tool and recipe must be tuned. This distinctly limits the ability of semiconductor manufacturers to transfer a process from one location to another or even one tool to another. A survey of the various processes in the SEMATECH fab was made to determine typical temperature measurement requirements. One result of the survey showed that the processes in semiconductor manufacturing cover a wide range of temperatures from -150 C to 1250 C. Other results of the survey will be presented methods now in use for making process temperature measurements will be described and potential new temperature measurement technologies will be described.

Citation Download Citation

Richard L. Anderson "Review of temperature measurements in the semiconductor industry", Proc. SPIE 1392, Advanced Techniques for Integrated Circuit Processing, (1 March 1991); https://doi.org/10.1117/12.48937

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