Paper
1 January 1992 Learning opportunities through the use of cluster tools
Thomas E. Seidel, Michael R. Stark
Author Affiliations +
Proceedings Volume 1594, Process Module Metrology, Control and Clustering; (1992) https://doi.org/10.1117/12.56617
Event: Microelectronic Processing Integration, 1991, San Jose, CA, United States
Abstract
Future semiconductor manufacture includes challenging requirements to maintain film interface quality and minimize contamination. In addition, there will also be a drive to reduce costs by reducing the number of operational steps or by increasing throughput. Processes driven by yield considerations are metal stacks, poly-metal dielectric (cluster tools exist today) and, in the future perhaps, gate stacks, poly emitters, and salicide contacts. Processes driven to reduce operational expenses are those that are used many times, such as lithocells (track and exposure tools) and, perhaps, metrology cells. This paper reviews the status and process intent of typical cluster tools and their architectures. It addresses many of the issues that exist and provides a theme that much learning is required to achieve a substantial cluster tool environment in a future factory environment.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas E. Seidel and Michael R. Stark "Learning opportunities through the use of cluster tools", Proc. SPIE 1594, Process Module Metrology, Control and Clustering, (1 January 1992); https://doi.org/10.1117/12.56617
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Cited by 1 scholarly publication.
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KEYWORDS
Semiconducting wafers

Process control

Chemical vapor deposition

Manufacturing

Etching

Metrology

Control systems

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