Paper
17 July 1979 Positive Photoresists As Ion Implantation Masks
David J. Elliott
Author Affiliations +
Abstract
The use of positive photoresists as ion implantation masks is considered in terms of processing advantage and specific applications. the relevant physical and functional properties are discussed with particular emphasis on thermal flow. Following the postbake study, ion implantation parameters are given, focusing on energy and dose ranges that facilitate complete and trouble-free resist removal. The use of new varian-extrion waycool stage for water cooling figure heavily here. Finally, the use of new positive photoresists for ion implantation mask in the future is reviewed.
© (1979) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David J. Elliott "Positive Photoresists As Ion Implantation Masks", Proc. SPIE 0174, Developments in Semiconductor Microlithography IV, (17 July 1979); https://doi.org/10.1117/12.957191
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Cited by 4 scholarly publications.
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KEYWORDS
Photoresist materials

Photomasks

Ions

Group IV semiconductors

Ion implantation

Semiconductors

Optical lithography

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