The detailed investigations of degradation processes, their characterization and understanding of mechanisms responsible for degradation is of great technological interest, both from the fabrication point of view, and as a long-term reliability concern. Some of the effects usually need investigation in the completed MOS transistor structure (hot carrier degradation, threshold voltage, and channel mobility deterioration), but others should be studied with the special test structures so that effects can be investigated independently (electromigration, radiation effects, oxide wear-out). The paper presents a review of problems related to reliability of VLSI ICs, degradation processes, and their characterization.
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