Laser processing for multichip module customization

Robert F. Miracky; Seyed Hassan Hashemi; Tom J. Hirsch; Heinrich G. Mueller; Tom Rudwick; Scott C. Sommerfeldt; William Weigler

doi:10.1117/12.142087

16 March 1993 Laser processing for multichip module customization

Robert F. Miracky, Seyed Hassan Hashemi, Tom J. Hirsch, Heinrich G. Mueller, Tom Rudwick, Scott C. Sommerfeldt, William Weigler

Author Affiliations +

Proceedings Volume 1804, Rapid Thermal and Laser Processing; (1993) https://doi.org/10.1117/12.142087
Event: Microelectronic Processing '92, 1992, San Jose, CA, United States

Abstract

We have applied laser direct-write processing techniques to the fabrication of 'multi-chip modules' (MCMs), a next-generation advanced semiconductor packaging technology. To minimize the amount of laser processing which is required, we have created new MCM designs which allow the formation of custom interconnects from generic wire segments solely by means of localized laser links and cuts. In a recent large scale demonstration, we successfully laser-customized a multi-chip modules by means of 3,970 links and 1,624 cuts. The multi-chip module functioned successfully when inserted into its test bed. Separate pulse propagation experiments on the passive substrate prior to assembly demonstrated that such laser-formed interconnects have performance virtually indistinguishable from conventionally patterned ones.

Citation Download Citation

Robert F. Miracky, Seyed Hassan Hashemi, Tom J. Hirsch, Heinrich G. Mueller, Tom Rudwick, Scott C. Sommerfeldt, and William Weigler "Laser processing for multichip module customization", Proc. SPIE 1804, Rapid Thermal and Laser Processing, (16 March 1993); https://doi.org/10.1117/12.142087

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