Board-to-board optical free-space interconnect: models and validations

Bruno Houssay; Sylvain Paineau

doi:10.1117/12.131232

23 October 1992 Board-to-board optical free-space interconnect: models and validations

Bruno Houssay, Sylvain Paineau

Proceedings Volume 1813, Optoelectronic Component Technologies; (1992) https://doi.org/10.1117/12.131232
Event: International Symposium on Optoelectronics in Computers, Communications, and Control, 1992, Hsinchu, Taiwan

Abstract

Massively parallel computers raise a major challenge to the interconnection designer by asking for more than the electrical connector and PCB backplane technology are able to perform. Many new configurations are being explored in optics such as the fiber and holographic interconnects. We describe a third option: optical interconnects between adjacent boards by means of free space beams. They present the significant advantage of being possibly packed (4 to 16 per mm2) much more heavily than electrical interconnects because they can be put at the output of the processor, therefore decreasing delay. They are working with short wavelength (around 0.85 micrometers ) LEDs to decrease the cost, the sensitivity to temperature shift, and increase the reliability. Crosstalk can be kept below 20 dB and still have reduced sensitivity to misalignment of the boards. LEDs and microlenses are solder bumped which provide mounting accuracy of around one micron.

Citation Download Citation

Bruno Houssay and Sylvain Paineau "Board-to-board optical free-space interconnect: models and validations", Proc. SPIE 1813, Optoelectronic Component Technologies, (23 October 1992); https://doi.org/10.1117/12.131232

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KEYWORDS

Light emitting diodes

Photodetectors

Computing systems

Free space optics

Optoelectronic devices

Microlens

Free space

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