Paper
4 August 1993 Lithography process monitor using light diffracted from a latent image
Lisa-Michelle Milner, Kenneth P. Bishop, S. Sohail H. Naqvi, John Robert McNeil
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Abstract
In this paper we discuss an optical metrology technique for the determination of optimum lithography parameters through an interrogation of the latent image. This technique, called the Lithography Process Monitor (LPM), involves illuminating a latent image grating with a laser beam. The intensity of the orders diffracted from the grating has been shown to be directly related to the photoactive compound (PAC) concentration profile, and consequently, to the profile of the developed resist. We have developed a method of modeling the intensity in the diffracted orders by using lithography simulation software in conjunction with rigorous coupled wave diffraction analysis. Experiments have been conducted with both positive and negative resist. In addition, we have been able to determine the 'absolute' location of the top of the photoresist with respect to the stepper focal reference and determine film thickness variations on the wafer.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lisa-Michelle Milner, Kenneth P. Bishop, S. Sohail H. Naqvi, and John Robert McNeil "Lithography process monitor using light diffracted from a latent image", Proc. SPIE 1926, Integrated Circuit Metrology, Inspection, and Process Control VII, (4 August 1993); https://doi.org/10.1117/12.149025
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CITATIONS
Cited by 3 scholarly publications and 4 patents.
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KEYWORDS
Semiconducting wafers

Lithography

Picture Archiving and Communication System

Diffraction

Image processing

Cadmium

Diffraction gratings

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