Paper
8 August 1993 Fabrication of 0.1-um T-shaped gates by phase-shifting optical lithography
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Abstract
We have developed a method for patterning sub-micrometer gates with T-shaped cross sections, which may be applied to manufacture high performance field effect transistors (FETs). The technique employs two exposures at the KrF excimer laser wavelength (248 nm). The first exposure uses a phase-shifting mask to pattern 0.1 micrometers isolated spaces. The resist used for the second exposure absorbs the 248 nm radiation strongly enough to produce a profile suitable for lift-off patterning.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hua-Yu Liu, Chung-yi Su, Nigel R. Farrar, and Robert E. Gleason "Fabrication of 0.1-um T-shaped gates by phase-shifting optical lithography", Proc. SPIE 1927, Optical/Laser Microlithography, (8 August 1993); https://doi.org/10.1117/12.150465
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CITATIONS
Cited by 6 scholarly publications and 1 patent.
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KEYWORDS
Photomasks

Phase shifts

Optical lithography

Electron beam lithography

Field effect transistors

Electron beams

Polymethylmethacrylate

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