Paper
12 November 1993 Microchannel heat exchangers: a review
John S. Goodling
Author Affiliations +
Abstract
The early work by Tuckerman and Pease on high-performance heat sinks has provoked numerous uses of them as a means of cooling electronic components. This paper is a review of 73 available works by academics and/or researchers who have used the original microchannel heat sink concept or have extended its design or use to turbulent flow, variable channel/fin width ratios, entrance effects, problem generalization, refined optimization, and macrochannel heat exchangers. Various investigators have reported design methodologies, designs, prototypical concepts, comparative and experimental results, and bold innovations on the use of microchannel heat sinks. Several computer codes are identified which perform the calculations needed to describe a particular heat sink: one examines laminar flow devices only, another investigates the effects of a myriad of parameters on the overall thermal resistance of the heat sink and a third offers a design methodology which determines the important dimensions for an optimal heat sink with no restrictions regarding flow type or channel to fin width ratios.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
John S. Goodling "Microchannel heat exchangers: a review", Proc. SPIE 1997, High Heat Flux Engineering II, (12 November 1993); https://doi.org/10.1117/12.163830
Lens.org Logo
CITATIONS
Cited by 37 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Resistance

Semiconductor lasers

Silicon

Heat flux

Thermal engineering

Packaging

Electronic components

Back to Top