Paper
23 June 1994 One-micrometer, radiation-hardened complementary metal oxide semiconductor for cryogenic analog applications
Imelda Groves, George A. Brown, G. Pollack, K. Green, Larry C. Dawson, Arvind I. D'Souza, Chih-Chia Lin, M. Song, C. Hwang, Jason C.S. Woo, Kenneth P. MacWilliams
Author Affiliations +
Abstract
Results are presented of a process-development effort to achieve a 1-Mrad silicon (Si) radiation-hardening capability at temperatures down to 40 K, using Texas Instruments high volume, 1-micrometer commercial process. The one-micrometer process was characterized at 77 K and 40 K: radiation effects on the baseline SiO2 gate dielectric and N-channel field effect transistor edges were observed, as were freeze-out and hot-carrier effects of the lightly doped drain implants. These freeze-out phenomena were confirmed, using SUPREM, MINIMOS, and MEDICI. The simulated data compared favorably with measured results. Simulations were run, using various implant doses and profiles to eliminate the freeze-out and hot-carrier effects in the new process. Devices having these simulated profiles were processed, and the results are presented.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Imelda Groves, George A. Brown, G. Pollack, K. Green, Larry C. Dawson, Arvind I. D'Souza, Chih-Chia Lin, M. Song, C. Hwang, Jason C.S. Woo, and Kenneth P. MacWilliams "One-micrometer, radiation-hardened complementary metal oxide semiconductor for cryogenic analog applications", Proc. SPIE 2226, Infrared Readout Electronics II, (23 June 1994); https://doi.org/10.1117/12.178494
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Cited by 4 scholarly publications.
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KEYWORDS
Analog electronics

CMOS technology

Cryogenics

Silicon

Dielectrics

Field effect transistors

Radiation effects

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