Paper
11 November 1994 Micromachined silicon x-ray optics
Andrew W. Chen, Philip E. Kaaret, Thomas W. Kenny
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Abstract
We employed anisotropic etching of single crystal silicon wafers for the fabrication of micron- scale optical elements. We have succeeded in producing silicon lenses with a geometry suitable for 1-d focusing x-ray optics. These lenses have an aspect ratio (40:1) suitable for x- ray reflection and have very good optical surface alignment. We have developed a number of process refinements which improved the quality of the lens geometry and the repeatability of the etch process. A significant progress was made in obtaining good optical surface quality. The RMS roughness was decreased from 110 angstroms for our initial lenses to 30 angstroms in the final lenses. A further factor of three improvement in surface quality is required for the production of efficiency x-ray optics. We present new wafer geometries designed to test the effect of the etch process on surface roughness.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrew W. Chen, Philip E. Kaaret, and Thomas W. Kenny "Micromachined silicon x-ray optics", Proc. SPIE 2279, Advances in Multilayer and Grazing Incidence X-Ray/EUV/FUV Optics, (11 November 1994); https://doi.org/10.1117/12.193147
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Cited by 3 scholarly publications.
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KEYWORDS
Etching

Silicon

Semiconducting wafers

Crystals

Microchannel plates

X-ray optics

Lenses

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