As-deposited properties and rapid thermal annealing effects on Ti/TiN barrier layer for aluminum plug technology

De-Dui Liao; Yih-Shung Lin; Hong Yang; Howard Witham; Javier Saenz; Jeff S. May; Jen-Jiang J. Lee

doi:10.1117/12.186056

9 September 1994 As-deposited properties and rapid thermal annealing effects on Ti/TiN barrier layer for aluminum plug technology

De-Dui Liao, Yih-Shung Lin, Hong Yang, Howard Witham, Javier Saenz, Jeff S. May, Jen-Jiang J. Lee

Author Affiliations +

Proceedings Volume 2335, Microelectronics Technology and Process Integration; (1994) https://doi.org/10.1117/12.186056
Event: Microelectronic Manufacturing, 1994, Austin, TX, United States

Abstract

This paper reports on the dramatically enhanced effect rapid thermal anneal (RTA) treatment has on the aluminum (Al) diffusion barrier integrity of reactively sputtered low density titanium nitride (TiN). This low density as sputtered TiN is shown to be superior to high density as sputtered TiN after both films have undergone an identical RTA treatment. The superior integrity of the low density TiN is attributed to enhanced oxygen gettering during RTA treatment at the Ti/TiN interface. This oxygen gettering has been shown to create a titanium oxynitride (TiON) layer between the Ti and TiN which accounts for the greatly enhanced barrier integrity.

Citation Download Citation

De-Dui Liao, Yih-Shung Lin, Hong Yang, Howard Witham, Javier Saenz, Jeff S. May, and Jen-Jiang J. Lee "As-deposited properties and rapid thermal annealing effects on Ti/TiN barrier layer for aluminum plug technology", Proc. SPIE 2335, Microelectronics Technology and Process Integration, (9 September 1994); https://doi.org/10.1117/12.186056

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