Paper
16 September 1994 Methods for parametric yield control for future 0.1-um deep submicron MOSFET manufacturing
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Abstract
A study to investigate systematic ways of controlling parametric yield for future production of deep submicron MOSFETs has been performed. It is important to know how and where in the manufacturing process the parametric yield can be controlled most efficiently, because for these devices no manufacturing expertise has yet been accumulated. Our study is based on a comparative sensitivity analysis, which has revealed that yield control techniques employed in micron size devices may not be efficient in deep submicron size devices, making a reorientation for manufacturing control mandatory.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Renate Sitte, Sima Dimitrijev, and H. Barry Harrison "Methods for parametric yield control for future 0.1-um deep submicron MOSFET manufacturing", Proc. SPIE 2336, Manufacturing Process Control for Microelectronic Devices and Circuits, (16 September 1994); https://doi.org/10.1117/12.186790
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Cited by 1 scholarly publication.
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KEYWORDS
Semiconducting wafers

Manufacturing

Control systems

Oxides

Field effect transistors

Process control

Monte Carlo methods

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