Using cost of ownership (COO) modeling to optimize productivity and wafer output of sputtering tools

Sergio Edelstein; Rob Davenport; Jaim Nulman

doi:10.1117/12.186786

16 September 1994 Using cost of ownership (COO) modeling to optimize productivity and wafer output of sputtering tools

Sergio Edelstein, Rob Davenport, Jaim Nulman

Proceedings Volume 2336, Manufacturing Process Control for Microelectronic Devices and Circuits; (1994) https://doi.org/10.1117/12.186786
Event: Microelectronic Manufacturing, 1994, Austin, TX, United States

Abstract

The SEMATECH COO model has been used as a design tool to optimize the hardware and application-dependent configurations of the Endura PVD system. The model helped identify and quantify the effects of improved equipment hardware, configurations, and processes. Sensitivity analyses were performed to determine the effect of throughput, chamber and system maintenance down time, reliability, equipment cost, consumables life and cost, and system configuration on cost per wafer (CPW) and wafer starts per week (WSPW). The results indicate that throughput and preventive maintenance down time have the greatest impact on COO. Equipment components were selected or designed and processes and procedures were developed to minimize the CPW and maximize the WSPW per tool. Increases in WSPW of 40 to 60% have been achieved by increasing overall throughput, decreasing PM time, and optimizing PM scheduling. These improvements can yield up to 25% reduction in cost per wafer.

Citation Download Citation

Sergio Edelstein, Rob Davenport, and Jaim Nulman "Using cost of ownership (COO) modeling to optimize productivity and wafer output of sputtering tools", Proc. SPIE 2336, Manufacturing Process Control for Microelectronic Devices and Circuits, (16 September 1994); https://doi.org/10.1117/12.186786

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