TIS uniformity maps of wafers, disks, and other samples

John C. Stover; Marvin L. Bernt; Tod F. Schiff

doi:10.1117/12.218336

1 September 1995 TIS uniformity maps of wafers, disks, and other samples

John C. Stover, Marvin L. Bernt, Tod F. Schiff

Proceedings Volume 2541, Optical Scattering in the Optics, Semiconductor, and Computer Disk Industries; (1995) https://doi.org/10.1117/12.218336
Event: SPIE's 1995 International Symposium on Optical Science, Engineering, and Instrumentation, 1995, San Diego, CA, United States

Abstract

Total integrated scatter measurements, the earliest well defined measurement relating light scatter to surface roughness, is now being used in modern production facilities as a means of monitoring product surface roughness. The two applications reviewed here are computer disks, where the issue is a well defined roughness (as opposed to the smoothest possible surface) and an emerging issue with roughness specifications for the backsides of silicon wafers. The paper describes a scanning instrument that allows sample uniformity to be revealed and thus the manufacturing process investigated.

Citation Download Citation

John C. Stover, Marvin L. Bernt, and Tod F. Schiff "TIS uniformity maps of wafers, disks, and other samples", Proc. SPIE 2541, Optical Scattering in the Optics, Semiconductor, and Computer Disk Industries, (1 September 1995); https://doi.org/10.1117/12.218336

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