Advanced solderless flexible thermal link

Brian G. Williams; Scott M. Jensen; J. Clair Batty

doi:10.1117/12.254144

14 October 1996 Advanced solderless flexible thermal link

Brian G. Williams, Scott M. Jensen, J. Clair Batty

Proceedings Volume 2814, Cryogenic Optical Systems and Instruments VII; (1996) https://doi.org/10.1117/12.254144
Event: SPIE's 1996 International Symposium on Optical Science, Engineering, and Instrumentation, 1996, Denver, CO, United States

Abstract

Flexible thermal links play an important role int he thermal management of cryogenically cooled components. The purpose of these links is to provide a means of transferring heat from a cooled component to a cooler reservoir with little increase in temperature. The standard soldered approach although effective proves to be time consuming and contributes to added thermal impedances which degrade the performance of the link. For system with little tolerance for temperature differences between cooled components and a cooling source this is undesirable. The authors of this paper have developed a technique by which thin metal foil or braided wire can be attached to metal end blocks without any solder using the swaging process. Swaging provides a fast, simple method for providing a low thermal impedance between the foils and blocks. This paper describes the characteristics of these thermal links in terms of length, mass, thermal resistance, flexibility, and survivability.

Citation Download Citation

Brian G. Williams, Scott M. Jensen, and J. Clair Batty "Advanced solderless flexible thermal link", Proc. SPIE 2814, Cryogenic Optical Systems and Instruments VII, (14 October 1996); https://doi.org/10.1117/12.254144

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