Use of exposure compensation to improve device performance for speed and binning based on electrical parametric feedback into fabrication design

Paul W. Ackmann; Stuart E. Brown; Richard D. Edwards; Doug Downey; Mark Michael; Karen L. Turnquest; John L. Nistler

doi:10.1117/12.275998

7 July 1997 Use of exposure compensation to improve device performance for speed and binning based on electrical parametric feedback into fabrication design

Paul W. Ackmann, Stuart E. Brown, Richard D. Edwards, Doug Downey, Mark Michael, Karen L. Turnquest, John L. Nistler

Author Affiliations +

Proceedings Volume 3051, Optical Microlithography X; (1997) https://doi.org/10.1117/12.275998
Event: Microlithography '97, 1997, Santa Clara, CA, United States

Abstract

As the device performance requirements tighten to improve speed distributions, the speed binning caused by across the wafer critical dimension (CD) variation will have significant impact on manufacturing performance yields. Overall speed performance yields are impacted by wafer to wafer and across wafer poly CD and poly profile variation caused at photo and etch. With the use of our final technique, called `Exposure Compensation', we were able to compensate for CD variation seen at final FI CD and electrical test. Implementation of exposure compensation process gave an effective two week control that exceeded the goal of 90 nm total electrical distribution. The improved control at FI CD can clearly be seen from the results of electrical measurements and transistor performance. While the techniques adequately improve site to site variation, further work is still required to improve across field variation.

Citation Download Citation

Paul W. Ackmann, Stuart E. Brown, Richard D. Edwards, Doug Downey, Mark Michael, Karen L. Turnquest, and John L. Nistler "Use of exposure compensation to improve device performance for speed and binning based on electrical parametric feedback into fabrication design", Proc. SPIE 3051, Optical Microlithography X, (7 July 1997); https://doi.org/10.1117/12.275998

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available