Development and characterization of multilevel metal interconnection etch process

Kim Dang

doi:10.1117/12.284625

25 August 1997 Development and characterization of multilevel metal interconnection etch process

Kim Dang

Proceedings Volume 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III; (1997) https://doi.org/10.1117/12.284625
Event: Microelectronic Manufacturing, 1997, Austin, TX, United States

Abstract

A more robust chlorine chemistry based reactive ion etch (RIE) process was developed, characterized and optimized to anisotropically etch the interconnecting metal layers for use in the fabrication of CMOS and BiCMOS IC devices, using the Lam 4600 single wafer etcher. The titanium nitride and titanium silicide buried layer, used in the metal 1 structure, present unique constraints on etch selectivity to the underlying film. The process must clear metal stringers with minimal lateral etching of the aluminum during the tiN/Ti etch and overetch steps. The new optimized process meets all requirements imposed by advanced technologies, such as vertical metal sidewalls, wide process latitude, tight CD control, minimal of TEOS oxide underlayer, less sensitivity to photoresist pattern, excellent reliability and reproducibility, and lower level of polymer (reaction by- product) build-up in reactor chamber which could lead to metal corrosion and cluster defects.

Citation Download Citation

Kim Dang "Development and characterization of multilevel metal interconnection etch process", Proc. SPIE 3213, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing III, (25 August 1997); https://doi.org/10.1117/12.284625

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available