Fabrication of spatial light modulator backplanes using damascene processing

Anthony O'Hara; Georg K.H. Bodammer; David G. Vass; Larry McGhee; J. Tom M. Stevenson; Ian Underwood

doi:10.1117/12.305496

20 April 1998 Fabrication of spatial light modulator backplanes using damascene processing

Anthony O'Hara, Georg K.H. Bodammer, David G. Vass, Larry McGhee, J. Tom M. Stevenson, Ian Underwood

Proceedings Volume 3292, Spatial Light Modulators; (1998) https://doi.org/10.1117/12.305496
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

The alignment of ferroelectric liquid crystal (FLC) is heavily influenced by the FLC flow rate during SLM cell filling. This flow rate is affected by a number of factors, one aspect of which is the structure of the silicon backplane. Even when the device has been planarized the structure of the pixelated top layer metal still influences the FLC flow rate and therefore the FLC alignment. We have produced a flat silicon backplane substrate using damascene processing to manufacture the mirror/electrodes. Damascene processing is a metal polishing technique. In this process the oxide layer which has already been polished is etched to create trenches in the desired pattern of the metal layer, a blanket deposition of metal is then performed, which fills the trenches and covers the wafer surface, finally CMP is performed, which removes the excess material on the wafer surface leaving the metal in the trenches and the top surface flat. There are some problems associated with damascene processing which will affect its suitability in the micro-=fabrication of SLM backplanes. The softer metal material is prone to dishing and scratching and the harder oxide material can be eroded. THese effects are dependent on the level of control of the CMP process. A process is being developed, using novel slurry chemistries, to allow the incorporation of this technique into our post-processing procedure. The results of the application of this process to test structures and an analysis of the suitability of this technique in the microfabrication of SLM silicon backplanes will be presented.

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Anthony O'Hara, Georg K.H. Bodammer, David G. Vass, Larry McGhee, J. Tom M. Stevenson, and Ian Underwood "Fabrication of spatial light modulator backplanes using damascene processing", Proc. SPIE 3292, Spatial Light Modulators, (20 April 1998); https://doi.org/10.1117/12.305496

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KEYWORDS

Mirrors

Metals

Spatial light modulators

Oxides

Semiconducting wafers

Silicon

Polishing

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