Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below

Alain S. Harrus; John Kelly; Ronald A. Powell

doi:10.1117/12.324037

4 September 1998 Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below

Alain S. Harrus, John Kelly, Ronald A. Powell

Author Affiliations +

Proceedings Volume 3508, Multilevel Interconnect Technology II; (1998) https://doi.org/10.1117/12.324037
Event: Microelectronic Manufacturing, 1998, Santa Clara, CA, United States

Abstract

ULSI circuit performance is constantly increasing, in speed, functionality and device density. This performance increase is supported by the constant development of new processes and new materials, on new equipment platforms, which support the demand for improved defect density and throughput. A key challenge for equipment infrastructure to continue to support this performance acceleration is the shortening of cycle time for equipment development and new material acceptance.

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Alain S. Harrus, John Kelly, and Ronald A. Powell "Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below", Proc. SPIE 3508, Multilevel Interconnect Technology II, (4 September 1998); https://doi.org/10.1117/12.324037

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