Paper
31 August 1998 Composite cantilever beam-mass structure gyroscope by a novel etching technology
Xinxin Li, Minhang Bao, Heng Yang, Shaoqun Shen, Weiyuan Wang
Author Affiliations +
Proceedings Volume 3511, Micromachining and Microfabrication Process Technology IV; (1998) https://doi.org/10.1117/12.324321
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
Described in this paper are a novel composite beam-mass structure and a micro gyroscope based on the structure. The composite beam consists of two sections: a section of vertical beam with a cross-section vertical to the wafer surface and a section of horizontal beam near the wafer surface. As the two sections have two orthogonal compliant directions, the structure has two orthogonal vibration modes: a vertical vibration mode decided by the horizontal beam and a lateral vibration mode decided by the vertical beam. Therefore, a vibratory gyroscope can be developed by this composite beam structure with a mass attached. As the composite beam is a multilevel structure that can hardly be fabricated by a conventional anisotropic etching technology, a novel 'maskless etching' technology for <100> vertical steps has been developed for the structure. Piezoresistive bridges on the surfaces of the horizontal and the vertical beams are used to monitor the driving vibration and to sense the output signal. Testing shows that the sensitivity from the piezoresistive bridge is 0.22 (mu) V/(degrees/sec) under a 6V AC driving with a DC bias. The special advantage of the sensor is the ability of working in an atmospheric environment.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xinxin Li, Minhang Bao, Heng Yang, Shaoqun Shen, and Weiyuan Wang "Composite cantilever beam-mass structure gyroscope by a novel etching technology", Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); https://doi.org/10.1117/12.324321
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KEYWORDS
Etching

Composites

Gyroscopes

Semiconducting wafers

Bridges

Anisotropic etching

Sensors

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