Paper
1 September 1998 Development of TiNi shape memory alloy film deposited by sputtering from separate Ti and Ni targets
Akihiro Ohta, Shekhar Bhansali, Isao Kishimoto, Akira Umeda
Author Affiliations +
Proceedings Volume 3512, Materials and Device Characterization in Micromachining; (1998) https://doi.org/10.1117/12.324049
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
A separate-target sputtering process has been applied to fabrication of TiNi shape memory alloy (SMA) for microelectromechanical systems (MEMS). This process employs separate Ti and Ni sputtering targets and independently controllable RF power source for each target. Since RF power ratio can change the composition of the films as required, the shape memory properties can be better controlled. This process would enable efficient batch production of MEMS devices and components similarly to the LSI batch process. This process is expected to be a more appropriate method for mass production than other techniques such as machining from bulk SMA sheets or wires and deposition of SMA films from a single TiNi alloy target. The TiNi SMA films in the present study were fabricated by co-sputtering from two separate targets and vacuum-annealing for crystallization. The phase transformation behavior of the crystallized films was observed by differential scanning calorimetry (DSC) and x-ray diffractometry (XRD). DSC showed exothermic/endothermic peaks corresponding to phase transformations: martensitic transformation around at 345 K and reverse martensitic transformation around at 365 K. The transformations of crystal structure were also examined by temperature-controlled XRD analysis. The formed films were confirmed to show shape memory effect (SME) by these results.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Akihiro Ohta, Shekhar Bhansali, Isao Kishimoto, and Akira Umeda "Development of TiNi shape memory alloy film deposited by sputtering from separate Ti and Ni targets", Proc. SPIE 3512, Materials and Device Characterization in Micromachining, (1 September 1998); https://doi.org/10.1117/12.324049
Lens.org Logo
CITATIONS
Cited by 2 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Shape memory alloys

Sputter deposition

Nickel

Silicon

Crystals

Microelectromechanical systems

Annealing

Back to Top