PMMA development studies using various synchrotron sources and exposure conditions

Ming X. Tan; Michelle A. Bankert; Stewart K. Griffiths; Aili Ting; Dale R. Boehme; Shondelle Wilson; Lianna M. Balser

doi:10.1117/12.324068

1 September 1998 PMMA development studies using various synchrotron sources and exposure conditions

Ming X. Tan, Michelle A. Bankert, Stewart K. Griffiths, Aili Ting, Dale R. Boehme, Shondelle Wilson, Lianna M. Balser

Proceedings Volume 3512, Materials and Device Characterization in Micromachining; (1998) https://doi.org/10.1117/12.324068
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

PMMA has been the primary resist used in synchrotron exposures for micro-machined parts fabricated by the LIGA process. Because development of this resist directly influences both tolerances and surface finish of completed LIGA structures, it is important to have a good quantitative understanding of PMMA development as a function of the absorbed dose, as well as both the exposure and development conditions. The various synchrotron sources used for LIGA fabrication vary widely in beam energy and flux, and these variations would be expected to influence development rates. Here we present a simple method to measure PMMA development rate over a moderate range of doses using only a single exposure at the synchrotron source. By employing several exposures, this method allows ready determination of development rates over a wide range of exposure and development conditions. Results are presented for the kinetics of PMMA development over a range of development temperatures, absorbed doses, dose rates and sample ages for exposures performed at three major x-ray sources in the United States.

Citation Download Citation

Ming X. Tan, Michelle A. Bankert, Stewart K. Griffiths, Aili Ting, Dale R. Boehme, Shondelle Wilson, and Lianna M. Balser "PMMA development studies using various synchrotron sources and exposure conditions", Proc. SPIE 3512, Materials and Device Characterization in Micromachining, (1 September 1998); https://doi.org/10.1117/12.324068

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