Fabrication of micromachined microwave couplers by CMOS process

Chienliu Chang; Jinhong Chio; Kaihsiang Yen; Peizen Chang; Sheyshi Lu

doi:10.1117/12.323913

8 September 1998 Fabrication of micromachined microwave couplers by CMOS process

Chienliu Chang, Jinhong Chio, Kaihsiang Yen, Peizen Chang, Sheyshi Lu

Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323913
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States

Abstract

Since the 0.6 micrometers SPTM (Single Polysilicon and Three Metals) process provided by TSMC (Taiwan Semiconductor Manufacturer Company) has three metal layers available, miscellaneous microwave passive components are feasible and easily fabricated. The aim of our study is to minimize the conventional microwave couplers by commercial CMOS process. Combining communication application and semiconductor technology, this study takes advantages as following: (1) Miniaturization of the microwave passive components is feasible by CMOS process. (2) Only small area is required. (3) Microwave characteristics can be tested on-wafer. (4) Almost following the commercial CMOS process provided by TSMC, there is no post-process.

Citation Download Citation

Chienliu Chang, Jinhong Chio, Kaihsiang Yen, Peizen Chang, and Sheyshi Lu "Fabrication of micromachined microwave couplers by CMOS process", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); https://doi.org/10.1117/12.323913

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