Paper
8 September 1998 Micromachined inductive displacement sensor
Thomas Velten, Peter Krause, D. Stefan, Ernst Obermeier
Author Affiliations +
Proceedings Volume 3514, Micromachined Devices and Components IV; (1998) https://doi.org/10.1117/12.323906
Event: Micromachining and Microfabrication, 1998, Santa Clara, CA, United States
Abstract
In this paper a new concept for a micro coil for the realization of a displacement sensor or angular sensor is presented. The sensor consists of a 3D coil, consisting of two half coils and a movable iron core. Though the coil is fabricated by means of silicon bulk micromachining, it is possible to move an iron core through the coil without destroying the windings. The inductance of the coil is 0.25 (mu) H without core and 7.2 (mu) H with core. The ohmic resistance has a value of 60 (Omega) . The sensors developed are used in gesture recognition. For this application several micro coils are mounted on a data glove. The sensors have the task to measure the flexion of fingers.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Velten, Peter Krause, D. Stefan, and Ernst Obermeier "Micromachined inductive displacement sensor", Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); https://doi.org/10.1117/12.323906
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KEYWORDS
Sensors

Silicon

Iron

Photoresist materials

Etching

Inductance

Semiconducting wafers

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