Paper
6 August 1999 Thermomechanical design of a microchannel cooled semiconductor laser diode array package
Enchao C. Yu, Andrzej J. Przekwas
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© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Enchao C. Yu and Andrzej J. Przekwas "Thermomechanical design of a microchannel cooled semiconductor laser diode array package", Proc. SPIE 3625, Physics and Simulation of Optoelectronic Devices VII, (6 August 1999); https://doi.org/10.1117/12.356913
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Cited by 4 scholarly publications.
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KEYWORDS
Semiconductor lasers

3D modeling

Diamond

Silicon

Chemical vapor deposition

Copper

Diodes

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