Modal analysis of the SCALPEL mask using experimental and numerical methods

William H. Semke; Michael P. Schlax; Roxann L. Engelstad; Edward G. Lovell; James Alexander Liddle

doi:10.1117/12.351129

25 June 1999 Modal analysis of the SCALPEL mask using experimental and numerical methods

William H. Semke, Michael P. Schlax, Roxann L. Engelstad, Edward G. Lovell, James Alexander Liddle

Proceedings Volume 3676, Emerging Lithographic Technologies III; (1999) https://doi.org/10.1117/12.351129
Event: Microlithography '99, 1999, Santa Clara, CA, United States

Abstract

Controlling the dynamic response of the SCALPEL mask is important to ensure high throughput consistent with the stringent error budgets allocated for sub-130 nm lithography. In this paper experimental and numerical modal analysis result for the SCALPEL mask are presented and compared. These experimental result are used to verify and benchmark the finite element modeling efforts. The mode shapes and their respective frequencies provide valuable information for characterizing the out-of-plane and in-plane oscillations of the mask. The out-of-plane mode shapes were found experimentally with the use of both a Zygo interferometer and a Polytec scanning laser vibrometer. An additional application for out-of-plane oscillations involves a SCALPEL mask cleaning procedure, called the PLAMAX process, where the mask is resonated at its natural frequencies while surface particles are electrostatically charged in the present of a plasma and removed. The in-plane vibrations of the SCALPEL mask have also been investigated, since this is the primary excitation mode of the mask during exposure stepping. For experimental data, the in-plane modes were excited mechanically and detected using a MTI Fotonic sensor fiber-optic probe.

Citation Download Citation

William H. Semke, Michael P. Schlax, Roxann L. Engelstad, Edward G. Lovell, and James Alexander Liddle "Modal analysis of the SCALPEL mask using experimental and numerical methods", Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); https://doi.org/10.1117/12.351129

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