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25 June 1999 Production of SCALPEL masks in a commercial mask facility
Chris L. Newport, Jeffrey Parker, K. Michael Smith, Albert Benveniste, Nam-Wook Kim, David Reyland, Reginald C. Farrow, Anthony E. Novembre, Richard J. Kasica, Chester S. Knurek, Milton L. Peabody Jr., Len Rutberg
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Proceedings Volume 3676, Emerging Lithographic Technologies III; (1999) https://doi.org/10.1117/12.351088
Event: Microlithography '99, 1999, Santa Clara, CA, United States
Abstract
The purpose of this paper is to investigate the viability of fabricating SCALPEL masks at a DuPont Photomasks, Inc. commercial mask shop. The MEBES 4500 electron beam exposure system and standard inspection tools were used in SCALPEL manufacture to study the key issues to be overcome and the key components needed to succeed in large-scale manufacture. SCALPEL is a next generation lithography technology being researched and developed at Lucent Technologies as the semiconductor industry moves beyond optical lithography. The SCALPEL tool uses a membrane-type mask for high-resolution patterning on Si wafers. SCALPEL mask manufacturing present new and challenging operations in a commercial mask production facility. The production sequence of SCALPEL masks is not uncommon to the current Cr/Qz environment, but introduces the commercial facility to issues at a different level. SCALPEL mask exposure has been accomplished using MEBES III and an advanced MEBES 4500 e-beam lithography system. Pattern imaging, CD metrology, defect inspection, registration metrology, mask handling, and cleaning operations have been attempted with various levels of success. Data and further development of the processes in the commercial facility, along with the challenges and results of these experiences, are detailed in this presentation.
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Chris L. Newport, Jeffrey Parker, K. Michael Smith, Albert Benveniste, Nam-Wook Kim, David Reyland, Reginald C. Farrow, Anthony E. Novembre, Richard J. Kasica, Chester S. Knurek, Milton L. Peabody Jr., and Len Rutberg "Production of SCALPEL masks in a commercial mask facility", Proc. SPIE 3676, Emerging Lithographic Technologies III, (25 June 1999); https://doi.org/10.1117/12.351088
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KEYWORDS
Photomasks
Charged-particle lithography
Optical alignment
Semiconducting wafers
Metrology
Electron beam lithography
Metals
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