Paper
27 April 1999 Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements
David J. Stein, Dale L. Hetherington
Author Affiliations +
Abstract
Several techniques to predict pad failure during tungsten CMP were investigated for a specific consumable set. These techniques include blanket polish rate measurements and metrics derived from two endpoint detection schemes. Blanket polish rate decreased significantly near pad failure. Metrics from the thermal endpoint technique included change in peak temperature, change in the time to reach peak temperature, and the change in the slope of the temperature trace just prior to peak temperature all as a function of pad life. Average carrier motor current before endpoint was also investigated. Changes in these metrics were observed however these changes, excluding time to peak process temperature, were either not consistent between pads or too noisy to be reliable predictors of pad failure.
© (1999) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
David J. Stein and Dale L. Hetherington "Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); https://doi.org/10.1117/12.346904
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Cited by 9 scholarly publications.
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KEYWORDS
Polishing

Semiconducting wafers

Tungsten

Chemical mechanical planarization

Temperature metrology

Metals

Data processing

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